q product id w frequency/capacitance e structure/size t design u packaging ceralock r (mhz) cs ceramic resonators g pp t/v pp x pp a t mhz no capacitance built-in mhz built-in capacitance ls cc cr/ce/cg cv cw round lead type cap chip type small-cap chip type monolithic chip type small monolithic chip type thickness shear mode thickness expander mode thickness expander mode (3rd overtone) three-digit alphanumerics express "individual specification". structure/size -b0 -a0 -r0 -r1 packaging product id code code code y individual specification *** code frequency/capacitance design individual specification code (part number) r nominal center frequency expressed by four-digit alphanumerics. the unit is in hertz (hz). decimal point is expressed by capital letter " m ". with standard products, " y individual specification" is omitted, and " u package specification code" is carried up. bulk radial taping h 0 =18mm plastic taping ?180mm plastic taping ?330mm y *** e ce w t r 16m0 t v53 u -r0 q cs pp indicates initial frequency tolerance and load capacity. radial taping is applied to lead type and plastic taping to chip type. o part numbering
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